Wire bonders are used in the development, fabrication and packaging of microchips and other seminconductor devices. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. This seminar will include: an introduction to wire bonding, where wire bonding is used, wire bonding methods, current … Read more “Wire & Die Bonding Technical Seminar”
Wire & Die Bonding Technical Seminar
