Keyword(s): Journal: Year: Author:

Solidification of Sn-0.7Cu-0.15Zn Solder: In Situ Observation

Journal: Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science     Year: 2014     Issue: 2     Pages: 918-926
Authors: G. Zeng, S. D. McDonald, C. M. Gourlay, K. Uesugi, Y. Terada, H. Yasuda and K. Nogita