Wire bonders are used in the development, fabrication and packaging of microchips and other seminconductor devices. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages.
This seminar will include:
- an introduction to wire bonding,
- where wire bonding is used,
- wire bonding methods,
- current trends in wire bonding,
- an overview of wire bonding instruments
An extended Q&A session will follow the seminar allowing you to discuss wire bonding techniques that apply to your research.
Make sure you register, so we have enough morning tea for everyone.
10:30am – 11:30am — Seminar
11:30am – 12:00pm — Morning Tea
Friday, 9 November 2018
Tobias Hickmann – CEO, TPT Wire Bonders
Tobias has been with the company for 8 years. Tobias studied at the University of Applied Sciences, Munich, and held previous positions with Suss Mircotech (Mask Aligners) and Innolas (Laser Systems).
This seminar is brought to you by ANFF-Q, Nanovacuum and TPT: